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TECHNICAL
SOLDERING INSTRUCTIONS
Cleaning
1. Do not use harsh organic solvents such as acetone, trichloroethylene, Chlorsan, and/or diflon solvent for cleaning as they may cause
damage or hazing to the LED lens.
2. Recommended solvents for cleaning: deionized water or isopropyl alcohol.
3. Special attention should be taken if other chemicals are used for cleaning as they may damage the epoxy lens or housing.
4. Any cleaning should take place at room temperature and the wash duration should not exceed one minute.
5. Use forced-air drying immediately following water wash to remove excess moisture.
The technical notes in this catalog are subject to change without notice.
8. After soldering, allow at least three minutes for the component to cool to room temperature before further processing.
9. Refer to below table for summary of soldering instructions for dip, wave, and manual solder. Note that these are considered general
instructions and all soldering notes indicated above should take precedence.
Types
Dip soldering / *Wave Soldering
Iron soldering (with 1.5mm iron tip)
Temperature of
the soldering
bath
Maximum
soldering
time
Distance from
solder joint
to package
Temperature of
soldering iron
Maximum
soldering
time
Distance from
solder joint
to package
LEDs
<=260°C
3s
>=2mm
<=350°C
3s
>2mm
<=260°C
5s
>=5mm
<=350°C
5s
>5mm
SMDs
/
/
/
<=350°C
3s
(one time only)
/
DISPLAYs
*<=260°C
*3s
*>2mm
<=350°C
3s
>2mm
APPLICATION NOTES
Fig. 7
7. Refer to the appropriate product datasheet for details on specific soldering pay layout. To ensure proper bonding and setting of
the LED, solder paste must be evenly applied to each soldering pad. Refer to below diagram (Fig. 7) for example of improper solder
application.
Lead Forming
1. Any lead forming or bending must be done prior to soldering.
2. Avoid bending leads at the same point more than once as it may compromise the integrity of the leads.
3. Minimum clearance of 3mm is required between the base of the LED lens and the bend location. Refer to below diagram (Fig. 8).
SOLDERING APPLICATION NOTES